Folysky Technology Wuhan Co., Ltd.

Description : Substrate type: Alumina ceramics Substrate material thickness: 0.5mm Conducting layer: Cu Thickness of metal layer:35mm/35mm Surface preparation: heavy silver Metal single-sided /double sided: double sided Copper plated through hole: yes Solder mask: yes Features : 1.high precision, good electrical and thermal properties, high bonding strength of. 2.good weldability, blind hole through hole can be realized 3.mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4.a wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5.customized production, without mold opening, short production cycle.